Clustered rigid wafer test probe

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12248003
APP PUB NO 20240183880A1
SERIAL NO

18062096

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An IC device test probe has one or more clusters of a plurality of tapered probe tips that taper upon a taper plane that is orthogonal to a seating direction or force vector of the IC device test probe toward the IC device. Each of the plurality of tapered probe tips is seated against one contact of the IC device. In this manner, the IC device test probe is seated against multiple contacts and may therefore apply test signal(s) to these contacts serially, simultaneously, or the like. The IC device test probe allows the seating to small pitch IC devices and associated testing thereof. This allows for electrical characterization of the IC device by the same test signal(s) through the IC device test probe and ultimately through multiple contacts. The forces associated with seating the IC device test probe against the IC device contacts is effectively spread across multiple contacts.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINE CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Audette, David Michael Colchester, US 4 0
Keefe, Melissa Cortlandt Manor, US 1 0
Moore, Jacob Louis Milton, US 3 0
Neff, Peter William Cambridge, US 3 0
Wagner, Grant Jericho, US 24 183

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