Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump

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United States of America

PATENT NO 12246398
APP PUB NO 20230042727A1
SERIAL NO

17788527

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Abstract

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A solder bump forming member including: a base substrate having a plurality of recesses; and solder particles in the recesses, in which the solder particle has an average particle diameter of 1 to 35 μm and a C.V. value of 20% or less, and a part of the solder particle projects from the recess, or in cross-sectional view, when a depth of the recess is designated as H1, and a height of the solder particle is designated as H2, H12 is established.

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Patent Owner(s)

  • RESONAC CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akai, Kunihiko Tokyo, JP 25 51
Ejiri, Yoshinori Tokyo, JP 41 146
Kakehata, Junichi Tokyo, JP 4 0
Miyaji, Masayuki Tokyo, JP 23 274

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