Systems and methods for transferring heat generated in an electrical enclosure
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
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Mar 4, 2025
Grant Date -
Oct 26, 2023
app pub date -
Apr 22, 2022
filing date -
Apr 22, 2022
priority date (Note) -
In Force
status (Latency Note)
Importance
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US Family Size
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Non-US Coverage
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Abstract
A system for transferring heat generated in an electrical enclosure includes run-in buses, a thermally conductive plate, and at least one contact assembly secured to the plate. Each pair of adjacent run-in buses is separated by a space. The plate has at least one opening extending therethrough, and the plate receives the run-in buses through the at least one opening. The at least one contact assembly has spaced apart fingers that partially cover the at least one opening of the plate, and adjacent fingers define a slot. Each of the fingers is located in a space between adjacent run-in buses, and each of the run-in buses is located in a slot when the fingers are located in the spaces between adjacent run-in buses. The run-in buses and contact assembly fingers are oriented in an interleaved pattern.
First Claim
Other Claims data not available
Family
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International Classification(s)
- 2022 Application Filing Year
- H02B Class
- 176 Applications Filed
- 84 Patents Issued To-Date
- 47.73 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H02B Class
- 0 % this patent is cited more than
- < 1 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Sep 4, 2028 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 4, 2032 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 4, 2036 |