Methods and systems for improving fusion bonding

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12243848
APP PUB NO 20220367405A1
SERIAL NO

17666933

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Abstract

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Methods and systems for improving fusion bonding are disclosed. Plasma treatment is performed on a substrate prior to the fusion bonding, which leaves residual charge on the substrate to be fusion bonded. The residual charge is usually dissipated through an electrically conductive silicone cushion on a loading pin. In the methods, the amount of residual voltage on a test silicon wafer is measured. If the residual voltage is too high, this indicates the usable lifetime of the silicone cushion has passed, and the electrically conductive silicone cushion is replaced. This ensures the continued dissipation of residual charge during use in production, improving the quality of fusion bonds between substrates.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chi, Yuan-Hsin Taichung, TW 25 3
Chou, Yin-Tung Hsinchu, TW 1 0
Huang, Yen Hao Hsinchu, TW 1 0
Kuo, Hong-Ta Hsinchu, TW 3 0
Lin, Huang-Liang Hsinchu, TW 1 0
Lin, Sheng-Yuan Hsinchu, TW 45 508
Shen, Ming-Yi Miaoli, TW 12 28
Wang, Hsing-Yu Hsinchu, TW 3 0
Wang, I-Shi Taipei, TW 32 85
Yang, Tzu-Ping Hsinchu, TW 10 58

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