Methods and heat distribution devices for thermal management of chip assemblies

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12243802
APP PUB NO 20240347414A1
SERIAL NO

18634198

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • GOOGLE LLC

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beauchemin, Melanie Mountain View, US 18 131
Burgess, Connor Alameda, US 8 15
Iyengar, Madhusudan K Foster City, US 335 13760
Jain, Padam San Jose, US 19 36
Jouppi, Norman Paul Palo Alto, US 136 3306
Kang, Teckgyu Saratoga, US 41 154
Kwon, Woon-Seong Santa Clara, US 53 569
Li, Yuan Sunnyvale, US 465 4935
Malone, Christopher Mountain View, US 11 54
Samadiani, Emad Cupertino, US 19 119
Stevens-Yu, Nicholas Palo Alto, US 2 11
Wang, Yingying Sunnyvale, US 72 584

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Sep 4, 2028
7.5 Year Payment $3600.00 $1800.00 $900.00 Sep 4, 2032
11.5 Year Payment $7400.00 $3700.00 $1850.00 Sep 4, 2036
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00