Plasma processing apparatus
Number of patents in Portfolio can not be more than 2000
United States of America
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Mar 4, 2025
Grant Date -
Dec 1, 2022
app pub date -
May 25, 2022
filing date -
May 25, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
In a disclosed plasma processing apparatus, an electrostatic chuck provided in a chamber includes a first region on which a substrate is placed and a second region on which an edge ring is placed. The first region includes a first electrode provided therein. The second region including a second electrode provided therein. A first feed line connects the first electrode and a bias power supply generating a pulse of a voltage applied to the first electrode to each other. A second feed line connects the second electrode and the bias power supply or another bias power supply generating a pulse of the voltage applied to the second electrode to each other. The second feed line includes one or more sockets and one or more feed pins. The one or more feed pins have flexibility in a radial direction thereof and are fitted into the one or more sockets.
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