Demountable solder joints for coupling superconducting current paths

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12243682
APP PUB NO 20230207171A1
SERIAL NO

17913459

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Abstract

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Described are concepts directed toward systems, structures and techniques to create low-resistance, high current capacity, demountable solder joint connections. Such systems, structures and techniques may be used to simultaneously create low-resistance, high current capacity, demountable solder joint connections at multiple locations between no insulation (NI) superconductors and in particular between NI high temperature superconductors (HTS) such as may be used in NI-HTS magnets.

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Patent Owner(s)

  • MASSACHUSETTS INSTITUTE OF TECHNOLOGY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beck, William Watertown, US 25 129
Labombard, Brian Belmont, US 13 15
Mouratidis, Theodore Melbourne, AU 4 9

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