Method of using wafer stage

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12242199
APP PUB NO 20230400775A1
SERIAL NO

18448110

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Abstract

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A method of controlling a wafer stage includes moving the wafer stage to position an immersion hood over a first sensor in the wafer stage. The method further includes moving the wafer stage to position the immersion hood over a second sensor in the wafer stage. The method further includes moving the wafer stage to position the immersion hood over a first particle capture area on the wafer stage after moving the wafer stage to position the immersion hood over the second sensor. The method further includes moving the wafer stage to define a routing track over the first particle capture area. The method further includes moving the wafer stage to position the immersion hood over an area for receiving a wafer on the wafer stage after defining the routing track over the first particle capture area.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Yung-Yao Hsinchu, TW 73 134
Lin, Chih Chien Hsinchu, TW 5 10
Lin, Wei Chih Hsinchu, TW 15 19

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