Wafer test system and operating method thereof
Number of patents in Portfolio can not be more than 2000
United States of America
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Mar 4, 2025
Grant Date -
Nov 30, 2023
app pub date -
Nov 3, 2022
filing date -
Nov 3, 2022
priority date (Note) -
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Abstract
A wafer test system includes a chuck for supporting a wafer including a plurality of dies, a probe head for inputting a test signal for an electrical test to the probe card and receiving an electrical test result corresponding to the test signal, a probe card for inputting test signals to the dies through a plurality of pins and receiving test result, a sensing device mounted on the surface of the probe card, for sensing an active state occurring in the wafer when the electrical test is performed, and a determination unit for receiving the electrical test result and the active state information for the dies and determining whether each of the dies has failed using the result of the electrical test on the wafer and active state information.
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