Tapered revetment block with leveling pads
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
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Mar 4, 2025
Grant Date -
Jan 12, 2023
app pub date -
Jun 28, 2022
filing date -
Jun 28, 2022
priority date (Note) -
In Force
status (Latency Note)
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Importance

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Abstract
A revetment block includes a top surface, a bottom surface, a first pair of parallel, opposing sidewalls extending between the top surface and the bottom surface, and a second pair of parallel, opposing sidewalls extending between the top surface and the bottom surface and each extending between a first sidewall of the first pair of parallel and a second sidewall of the first pair of parallel, opposing sidewalls. The revetment block further includes a horizontal duct extending from the first sidewall to the second sidewall, wherein the horizontal duct is parallel with the bottom surface. The top surface has a non-parallel relationship with the bottom surface, wherein the top surface includes a leveling pad adjacent the first sidewall. The leveling pad is configured to cause a second horizontal duct of a second revetment block stacked on the top surface to be parallel with the first horizontal duct.
First Claim
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Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- CONTECH ENGINEERED SOLUTIONS LLC
International Classification(s)

- 2022 Application Filing Year
- E02B Class
- 169 Applications Filed
- 87 Patents Issued To-Date
- 51.48 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Karau, William Howard | Southlake, US | 7 | 90 |
# of filed Patents : 7 Total Citations : 90 | |||
Priest, Daniel J | Liberty Township, US | 2 | 0 |
# of filed Patents : 2 Total Citations : 0 |
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- 0 Citation Count
- E02B Class
- 0 % this patent is cited more than
- < 1 Age
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