Sputtering target and manufacturing method therefor

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12241153
APP PUB NO 20230349035A1
SERIAL NO

18207721

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Importance

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Abstract

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A sputtering target according to one embodiment is an integrated sputtering target comprising a target portion and a backing plate portion, both of them being made of copper and unavoidable impurities, wherein a Vickers hardness Hv is 90 or more, and wherein a flat ratio of crystal grains in a cross section orthogonal to a sputtering surface is 0.35 or more and 0.65 or less.

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First Claim

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Patent Owner(s)

  • JX ADVANCED METALS CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Morii, Yasushi Ibaraki, JP 29 244
Otsuki, Tomio Ibaraki, JP 16 64

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