Immersion cooling for integrated circuit devices

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12238892
SERIAL NO

17128620

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.

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Patent Owner(s)

  • INTEL CORP.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Armstrong, Jason Phoenix, US 11 20
Arrington, Kyle Gilbert, US 30 26
Chan, Arguedas Sergio Antonio Chandler, US 19 44
Chang, Je-Young Tempe, US 68 450
Chinkov, Alexey Haifa, IL 3 13
Cohen, Meir Chandler, US 16 217
Crocker, Michael Portland, US 51 2405
George, Paul Chandler, US 29 794
Liu, Kuang Queen Creek, US 16 23
Lofgreen, Kelly Phoenix, US 14 61
Mahajan, Ravindranath Chandler, US 40 234
Peled, Nir Chandler, US 5 94
Smith, Bradley Vancouver, US 56 529
Sover, Raanan Haifa, IL 12 110
Williams, James Portland, US 105 1827

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