Base structure and wafer placing device
Number of patents in Portfolio can not be more than 2000
United States of America
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Feb 25, 2025
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N/A
app pub date -
Mar 13, 2020
filing date -
Mar 13, 2020
priority date (Note) -
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Abstract
A base structure includes a base, a first conductor layer, and a via conductor. The base has a first surface. The first conductor layer is positioned along the first surface in the base. The via conductor includes a first part and a second part in a section that includes the via conductor and that extends in a first direction perpendicular to the first surface. The length of the first part in the first direction is larger than the thickness of the first conductor layer. The length of the second part in the first direction is larger than the thickness of the first conductor layer. The second part is continuous with the first part, and at least a portion of the outer edge of the second part is displaced from the outer edge of the first part when viewed in the first direction.
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