High-speed TIA anti-5G WIFI electromagnetic interference method
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United States of America
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Feb 25, 2025
Grant Date -
Jan 30, 2025
app pub date -
Jul 29, 2024
filing date -
Jul 29, 2024
priority date (Note) -
In Force
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Abstract
A high-speed TIA anti-5G WIFI electromagnetic interference method includes the steps of: stacking a high-voltage capacitor C9 and a resistor R11 for constructing a filter circuit on a bare DIE chip of TIA; splitting C9 into two parallel filter capacitors C91 and C92, which satisfy C9=C91+C92, C91=C92; constructing differential output to cancel signal interference; constructing electromagnetic interference that cancels out lens leakage by stacking avalanche photodiode APD, C91 and gold-plated pad on the vertical axis close to the bare DIE chip, and connecting to the pads through gold wires; stacking R11 and C92 on the vertical axis between pins VDD and VAPD, connecting R11 to C91 through gold wire No. 1, connecting C92 to pin VAPD through gold wire No. 2, the gold wire No. 1 and the gold wire No. 2 form a 90° angle to offset the electromagnetic interference leaked by the lens.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Chen, Fujie | Xiamen, CN | 8 | 2 |
Li, Jinghu | Xiamen, CN | 14 | 12 |
Shi, Liangqiong | Xiamen, CN | 3 | 0 |
Zhou, Yuanyuan | Xiamen, CN | 24 | 304 |
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