Semiconductor device and method for fabricating the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12237394
APP PUB NO 20230369441A1
SERIAL NO

18226262

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Abstract

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A method for fabricating semiconductor device includes the steps of first providing a substrate having a first region and a second region, forming a first bottom barrier metal (BBM) layer on the first region and the second region, forming a first work function metal (WFM) layer on the first BBM layer on the first region and the second region, and then forming a diffusion barrier layer on the first WFM layer.

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Patent Owner(s)

  • UNITED MICROELECTRONICS CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Ti-Bin Tainan, TW 22 18
Chou, Shih-Min Tainan, TW 23 32
Ho, Nien-Ting Tainan, TW 44 293
Huang, Wen-Yen Changhua County, TW 55 61
Li, Yi-Fan Tainan, TW 33 23
Wu, Chih-Chiang Tainan, TW 54 373
Wu, Zhen Kaohsiung, TW 70 365

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