System for laser bonding of flip chip

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12237296
APP PUB NO 20220052019A1
SERIAL NO

17516620

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.

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Patent Owner(s)

  • PROTEC CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ahn, Geunsik Seoul, KR 10 17
Ko, Youn Sung Chungcheongnam-do, KR 10 8

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