Semiconductor devices having supportive plating structures

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12237275
APP PUB NO 20230268290A1
SERIAL NO

17675951

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Importance

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Abstract

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A semiconductor package includes a substrate having a first surface, and a second surface opposite the first surface. The substrate includes a connection region having a first array of contact pads, and a peripheral region surrounding the connection region and having additional contact pads. A semiconductor die having an array of electrical contacts and thermal contacts, is connected to the first array of contact pads and to the additional contact pads. A plate is coupled to a top surface of the semiconductor die and there is at least one pin projecting from the plate toward the first substrate. The pin is disposed within a channel that extends between the plate and the additional contact. The plate, channel and pin improve the heat dissipation capabilities of the semiconductor device package.

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Patent Owner(s)

Patent OwnerAddress
SANDISK TECHNOLOGIES INC951 SANDISK DRIVE LEGAL DEP MILPITAS CA 95035

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ling, Janice Jia Min Penang, MY 1 1
Rasalingam, Uthayarajan A/L Penang, MY 14 2

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