Semiconductor devices including parallel electrically conductive layers

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12237246
APP PUB NO 20210287964A1
SERIAL NO

17196652

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Abstract

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A semiconductor device is disclosed. In one example, the semiconductor device includes a semiconductor chip including a first chip contact pad on a first chip main surface. The semiconductor device further includes a first electrically conductive layer arranged over the first chip main surface and electrically coupled to the first chip contact pad, wherein the first electrically conductive layer extends in a direction parallel to the first chip main surface. An electrical through connection is electrically coupled to the first electrically conductive layer and to a second electrically conductive layer, wherein the electrical through connection extends in a direction perpendicular to the first chip main surface, and wherein, in a top view of the first chip main surface, the electrical through connection and the semiconductor chip are non-overlapping.

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Patent Owner(s)

  • INFINEON TECHNOLOGIES AG

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fehler, Robert Regensburg, DE 14 14
Hoeglauer, Josef Heimstetten, DE 95 732
Kessler, Angela Sinzing, DE 65 382
Palm, Petteri Regensburg, DE 97 783

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