Method for wafer bonding including edge trimming

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12237165
APP PUB NO 20210358740A1
SERIAL NO

17390520

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The present disclosure for wafer bonding, including forming an epitaxial layer on a top surface of a first wafer, forming a sacrificial layer over the epitaxial layer, trimming an edge of the first wafer, removing the sacrificial layer, forming an oxide layer over the top surface of the first wafer subsequent to removing the sacrificial layer, and bonding the top surface of the first wafer to a second wafer.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chou, Cheng-Hsien Tainan, TW 152 1038
Hsiao, Hau-Yi Chiayi, TW 22 19
Huang, Chih-Hui Tainan County, TW 51 884
Lin, Yung-Lung Taichung, TW 52 478
Tzeng, Kuo-Hwa Taipei, TW 23 283

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Aug 25, 2028
7.5 Year Payment $3600.00 $1800.00 $900.00 Aug 25, 2032
11.5 Year Payment $7400.00 $3700.00 $1850.00 Aug 25, 2036
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00