Plasma processing assembly using pulsed-voltage and radio-frequency power

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United States of America

PATENT NO 12237148
APP PUB NO 20240030002A1
SERIAL NO

18375886

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Abstract

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Embodiments of the disclosure provided herein include an apparatus and method for the plasma processing of a substrate in a processing chamber. More specifically, embodiments of this disclosure describe a biasing scheme that is configured to provide a pulsed-voltage (PV) waveform delivered from one or more pulsed-voltage (PV) generators to the one or more electrodes within the processing chamber. The plasma process(es) disclosed herein can be used to control the shape of an ion energy distribution function (IEDF) and the interaction of the plasma with a surface of a substrate during plasma processing.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Byun, Daniel Sang Campbell, US 16 29
Cui, Linying Cupertino, US 30 140
Dhindsa, Rajinder Pleasanton, US 259 11448
Dorf, Leonid San Jose, US 74 1603
Guo, Yue Redwood City, US 100 278
Kamenetskiy, Evgeny Santa Clara, US 14 157
Luere, Olivier Sunnyvale, US 44 1750
Ramaswamy, Kartik San Jose, US 371 20119
Rogers, James Los Gatos, US 130 2190
Todorow, Valentin N Palo Alto, US 77 4997

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