Method of manufacturing a semiconductor device and apparatus for manufacturing the semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12235589
APP PUB NO 20230333486A1
SERIAL NO

18206970

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Abstract

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A method of manufacturing a semiconductor device includes dividing a number of dies along an x axis in a die matrix in each exposure field in an exposure field matrix delineated on the semiconductor substrate, wherein the x axis is parallel to one edge of a smallest rectangle enclosing the exposure field matrix. A number of dies is divided along a y axis in the die matrix, wherein the y axis is perpendicular to the x axis. Sequences SNx0, SNx1, SNx, SNxr, SNy0, SNy1, SNy, and SNyr are formed. p*(Nbx+1)−2 stepping operations are performed in a third direction and first sequence exposure/stepping/exposure operations and second sequence exposure/stepping/exposure operations are performed alternately between any two adjacent stepping operations as well as before a first stepping operation and after a last stepping operation. A distance of each stepping operation in order follows the sequence SNx.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Minfeng Hsinchu, TW 18 12
Chou, Shuo-Yen Hualien County, TW 26 951
Huang, Hsu-Ting Hsinchu, TW 41 301
Lin, Chin-Hsiang Hsinchu, TW 424 6439
Liu, Ru-Gun Zhubei, TW 404 6961
Yamazoe, Kenji Campbell, US 51 555
Yu, Shinn-Sheng Hsinchu, TW 132 3917

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