Backlight module, method for manufacturing the same, and display apparatus

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12235541
APP PUB NO 20250004323A1
SERIAL NO

18274726

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Abstract

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A backlight module includes a substrate provided with a light-emitting region and a bonding region, a plurality of light-emitting units disposed on a side of the substrate, a back plate disposed on the other side of the substrate, and at least three drive circuit boards bonded and connected to the bonding region by first connectors. Moreover, an extension direction of a long edge of each of the light-emitting units is not parallel to a bonding edge of the bonding region. In this way, when the back plate is a curved back plate, the risk of peeling of the light-emitting units from the substrate when the back plate is in a curved state can be reduced by flexibly setting the degree of the included angle between the extension direction of each long edge of each light-emitting unit and the bonding edge of the bonding region.

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Patent Owner(s)

  • HEFEI BOE RUISHENG TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO. LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gao, Liang Beijing, CN 159 619
Qi, Qi Beijing, CN 133 407
Sun, Jiwei Beijing, CN 32 100
Wang, Xiao Beijing, CN 252 824
Zhang, Bing Beijing, CN 221 806

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