Manufacturing method and application of optical interconnection module

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12235498
APP PUB NO 20220317395A1
SERIAL NO

17575981

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Abstract

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A manufacturing method and application of an optical interconnection module are disclosed. According to example embodiments, by providing the method of manufacturing the optical interconnection module in which an optical fiber optical coupler is disposed at its lower portion by using the FOWLP process, it is possible to provide advantages such as lightness, thinness and compactness of the optical interconnection module, guarantee of signal integrity, and high yield in mass production. Further, it is possible to provide a structure providing an electrical ground to an electronic chip by mounting the electronic chip on ETB and capable of being used as a heat dissipation path.

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Patent Owner(s)

  • ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huh, Joon Young Daejeon, KR 29 87
Kang, Sae-Kyoung Daejeon, KR 32 180
Lee, Joon Ki Sejong-si, KR 71 328

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