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Abstract

An on-chip strain measurement device that uses precision frequency measurements to precisely extract sub-nm displacements, allowing residual strain measurements in a given structural film. Strain-induced gap changes to resonance frequencies use differential strategies to remove bias uncertainty, allowing measurement of sub-nm displacements. Gap-dependent electrical stiffness is used to shift resonance frequencies as structural elements stretch or shrink to relieve strain. An output based on differential frequencies between two proximal structures with unequal stress arm lengths removes uncertainty on the initial gap spacing. The ability to precisely measure the frequency of the high-Q structures allows lifetime stress correction of micromechanical circuits, such as oscillators and filters.

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First Claim