Chemical solution, method for manufacturing chemical solution, and method for treating substrate

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United States of America

PATENT NO 12234399
APP PUB NO 20230340326A1
SERIAL NO

18341929

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Abstract

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A chemical solution, which demonstrates excellent etching performance for transition metal-containing substances and has excellent defect inhibition performance, a method for manufacturing the chemical solution, and a method for treating a substrate. The chemical solution according to an embodiment includes one or more kinds of periodic acids selected from the group consisting of a periodic acid and a salt thereof, one or more kinds of first metal components selected from the group consisting of Ti and Zr, and water. In a case where the chemical solution includes one kind of first metal component, a content of the one kind of first metal component is 1 ppt by mass to 100 ppm by mass with respect to a total mass of the periodic acids. In a case where the chemical solution includes two kinds of first metal components, a content of both the two kinds of first metal components is equal to or smaller than 100 ppm by mass with respect to the total mass of the periodic acids, and a content of at least one of the two kinds of first metal components is equal to or greater than 1 ppt by mass with respect to the total mass of the periodic acids.

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Patent Owner(s)

  • FUJIFILM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mizutani, Atsushi Shizuoka, JP 129 834
Seki, Hiroyuki Shizuoka, JP 236 3423
Sugimura, Nobuaki Shizuoka, JP 12 10
Takahashi, Tomonori Shizuoka, JP 121 1303

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