Electronic component and method of manufacturing electronic component

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12231110
APP PUB NO 20220278668A1
SERIAL NO

17745443

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An electronic component includes a substrate, a functional element on the substrate, a first electrode, a support body that is made of an insulator, a cover portion, a second electrode, and a projection. The first electrode is located on the substrate and connected to the functional element. The support body protrudes from the substrate and covers the first electrode. The cover portion opposes the substrate, and a hollow space is defined by the substrate, the support body, and the cover portion. The second electrode is located in a via hole extending through the support body and the cover portion and electrically connected to the first electrode. The projection is located on the first electrode in the via hole.

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First Claim

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Patent Owner(s)

  • MURATA MANUFACTURING CO LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Atarashi, Masakazu Nagaokakyo, JP 3 0
Fukushima, Masahiro Nagaokakyo, JP 148 318
Inoue, Kazunori Nagaokakyo, JP 183 1266
Kawasaki, Koichiro Nagaokakyo, JP 39 110
Nakanishi, Hidefumi Nagaokakyo, JP 6 50
Otsuka, Shintaro Nagaokakyo, JP 6 6
Toyota, Yasuyuki Nagaokakyo, JP 2 0

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