Electronic device with solder interconnect and multiple material encapsulant

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12231109
APP PUB NO 20220052667A1
SERIAL NO

17350842

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Importance

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Abstract

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The disclosure is directed to an electronic device with a solder interconnect and multiple material encapsulant. The electronic device includes a die last assembly with the die assembled to an electronic packaging substrate by a solder interconnect. At least a portion of a first dielectric material and the die are milled or ground, with a second dielectric material applied over an exposed portion of the die. A shield is then positioned over and electrically insulated from the die. Accordingly, such a configuration reduces a thickness or height of an electronic device with shielding and a die last assembly.

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Patent Owner(s)

  • QORVO US, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Carpenter, Charles E Apopka, US 12 67
Glascock, Howard Terry Apopka, US 3 5
Morris, Thomas Scott Apopka, US 45 1447
Stokes, Paul Apopka, US 51 599

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