Light-emitting diode packaging module having encapsulated array of LED chips

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12230612
SERIAL NO

17691638

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Abstract

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A light-emitting diode (LED) packaging module includes light-emitting units arranged in an array having m row(s) and n column(s), an encapsulating layer, and a wiring assembly, where m and n each independently represents a positive integer. Each of the light-emitting units includes LED chips each including a chip first surface, a chip second surface, a chip side surface, and an electrode assembly disposed on the chip second surface. The encapsulating layer covers the chip side surface and fills a space among the LED chips. The wiring assembly is disposed on the chip second surface and is electrically connected to the electrode assembly.

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Patent Owner(s)

  • QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cao, Aihua Xiamen, CN 5 3
Hsu, Chen-Ke Xiamen, CN 108 284
Lee, Chia-En Xiamen, CN 68 222
Liao, Chi-Wei Xiamen, CN 25 78
Liao, Yanqiu Xiamen, CN 10 7
Lin, Zhen-Duan Xiamen, CN 13 9
Shi, Junpeng Xiamen, CN 43 69
Wu, Zheng Xiamen, CN 157 1020
Xin, Shuning Xiamen, CN 5 3
Yu, Changchin Xiamen, CN 14 6

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