Processing chamber with multiple plasma units

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12230479
APP PUB NO 20240249918A1
SERIAL NO

18599767

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Importance

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Abstract

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Provided is a processing chamber configured to contain a semiconductor substrate in a processing region of the chamber. The processing chamber includes a remote plasma unit and a direct plasma unit, wherein one of the remote plasma unit or the direct plasma unit generates a remote plasma and the other of the remote plasma unit or the direct plasma unit generates a direct plasma. The combination of a remote plasma unit and a direct plasma unit is used to remove, etch, clean, or treat residue on a substrate from previous processing and/or from native oxide formation. The combination of a remote plasma unit and direct plasma unit is used to deposit thin films on a substrate.

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Patent Owner(s)

  • APPLIED MATERIALS INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Daito, Kazuya Milipitas, US 39 126
Kuratomi, Takashi San Jose, US 31 41
Lei, Pingyan San Jose, US 13 23
Lei, Yu Belmont, US 136 1885
Ravi, Jallepally San Ramon, US 44 947
Wu, Dien-Yeh San Jose, US 83 8828
Xu, Yi San Jose, US 319 2238

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