Compound, polymer, pattern forming material, pattern forming method, and method of manufacturing semiconductor device

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United States of America

PATENT NO 12228860
APP PUB NO 20240004298A1
SERIAL NO

18466668

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A pattern forming material used for forming an organic film on a film to be processed of a substrate having the film to be processed, the organic film being patterned and then impregnated with a metallic compound to form a composite film which is used as a mask pattern when processing the film to be processed, the pattern forming material contains a polymer including a monomer unit represented by the following general formula (3),

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Patent Owner(s)

  • KIOXIA CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asakawa, Koji Kawasaki Kanagawa, JP 222 4558
Sasao, Norikatsu Kawasaki Kanagawa, JP 47 84
Sugimura, Shinobu Yokohama Kanagawa, JP 63 247

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