Methods for laser bonding optical elements to substrates and optical assemblies fabricated by the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12228772
APP PUB NO 20220276445A1
SERIAL NO

17747231

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Abstract

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Methods for laser bonding optical elements to substrates and optical assemblies are disclosed. According to one embodiment, a method of bonding an optical element to a substrate includes disposing at least one optical element onto a surface of the substrate, electrostatically affixing the at least one optical element to the surface of the substrate, and directing a laser beam into the at least one optical element. The laser beam heats an interface between at least one optical element and the substrate to a temperature that is higher than a lowest temperature of the optical element change temperature and the substrate change temperature, thereby forming a bond between at least one optical element and the substrate at a bond area. The laser beam has a fluence that does not modify the substrate at areas of the substrate that are outside of the at least one optical element.

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Patent Owner(s)

Patent OwnerAddress
CORNING RESEARCH & DEVELOPMENT CORPORATIONONE RIVERFRONT PLAZA CORNING NY 14831

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lance, David Mark Elmira, US 4 1
Streltsov, Alexander Mikhailovich Corning, US 67 1201

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