Wafer probe device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12228590
APP PUB NO 20240003939A1
SERIAL NO

18470193

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An wafer probe device is provided, including a holder, and a probe card. The holder has a holding surface for holding a wafer. The probe card has a probing side for probing the wafer. Wherein the holder and the probe card are disposed on the ground, and the holding surface of the holder and the probing side of the probe card are perpendicular to the ground. Wherein when the holder holds the wafer to move upwardly toward the probe card into a probing position, the probed surface of the wafer is in contact with the probe card, and the probe surface is perpendicular to the ground.

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First Claim

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Family

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Patent Owner(s)

  • WINBOND ELECTRONICS CORP.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fu, Ting-Ming Hsinchu County, TW 6 5

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