Temperature sensing device and system on chip
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
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Feb 18, 2025
Grant Date -
Oct 6, 2022
app pub date -
Dec 27, 2021
filing date -
Dec 27, 2021
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A temperature sensing device including a first temperature sensor having a first resistor and a first capacitor and generating a first voltage applied to at least one of the first resistor or the first capacitor based on a first clock signal and a second clock signal generated by delaying the first clock signal, a second temperature sensor having a second resistor and a second capacitor and generating a second voltage applied to at least one of the second resistor or the second capacitor based on the first and second clock signals, a controller generating code data based on the first voltage and the second voltage and generating a control signal based on the code data, and a delay locked loop circuit delaying the first clock signal based on the control signal to generate the second clock signal may be provided.

First Claim
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- SAMSUNG ELECTRONICS CO. LTD.
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Kim, Joo Seong | Seoul, KR | 39 | 69 |
Kim, Kwang Ho | Yongin-si, KR | 72 | 875 |
Park, Jung Hyun | Seoul, KR | 107 | 282 |
Yang, Jun Hyeok | Seoul, KR | 17 | 122 |
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