Semiconductor device and method for forming the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12227410
APP PUB NO 20240140782A1
SERIAL NO

18404922

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Abstract

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The present disclosure provides a semiconductor device. The semiconductor device includes a first device and a second device disposed adjacent to the first device; a conductive pillar disposed adjacent to the first device or the second device; a molding surrounding the first device, the second device and the conductive pillar; and a redistribution layer (RDL) over the first device, the second device, the molding and the conductive pillar, wherein the RDL electrically connects the first device to the second device and includes an opening penetrating the RDL and exposing a sensing area over the first device.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Yi-Hsien Changhua County, TW 60 943
Cheng, Chun-Ren Hsinchu, TW 128 1344
Huang, Fu-Chun Hsinchu County, TW 44 76
Huang, Shih-Fen Hsinchu County, TW 87 331
Lin, Ching-Hui Taichung, TW 96 304
Liu, Chiahung Hsinchu, TW 15 41
Yeh, Po Chen New Taipei, TW 2 0

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