Method for fabricating air bridge, air bridge structure, and superconducting quantum chip

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12225832
APP PUB NO 20220216390A1
SERIAL NO

17704717

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This disclosure includes a method for fabricating an air bridge, an air bridge structure, and a superconducting quantum chip, and relates to the field of circuit structures. In some examples, a method for fabricating an air bridge includes forming an air bridge brace structure on a substrate, and forming, on the air bridge brace structure and the substrate, an air bridge material layer with one or more openings in the air bridge material layer that reveal the air bridge brace structure. The air bridge material layer with the one or more openings is formed based on a patterned photoresist layer with patterns corresponding to the one or more openings. The method further includes removing, based on the one or more openings in the air bridge material layer, the air bridge brace structure to obtain the air bridge having the one or more openings.

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Patent Owner(s)

  • TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED; SUZHOU INSTITUTE OF NANO-TECH & NANO-BIONICS (SINANO), CHINESE ACADEMY OF SCIENCES

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ding, Sunan Guangdong, CN 2 0
Feng, Jiagui Guangdong, CN 3 0
Huai, Sainan Guangdong, CN 14 4
Xiong, Kanglin Guangdong, CN 7 7
Zhang, Wenlong Guangdong, CN 64 78
Zheng, Yarui Guangdong, CN 9 5

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