TSV check circuit with replica path

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12224275
APP PUB NO 20220028749A1
SERIAL NO

17489502

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Disclosed herein is an apparatus that includes a first semiconductor chip, first and second TSVs penetrating the first semiconductor chip, a first path including the first TSV, a second path including the second TSV, a first charge circuit configured to charge the first path, a second charge circuit configured to charge the second path, a first discharge circuit configured to discharge the first path, a second discharge circuit configured to discharge the second path, and a comparator circuit configured to compare a potential of the first path with a potential of the second path.

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Patent Owner(s)

  • MICRON TECHNOLOGY INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Makabe, Harutaka Sagamihara, JP 5 7

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