Package module comprising marking and shield films and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12224249
APP PUB NO 20220028799A1
SERIAL NO

17497132

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A module is disclosed that includes a substrate having a first main surface, a first component mounted on the first main surface, a first sealing resin disposed so as to cover the first main surface and the first component, a marking film covering at least an upper surface of the first sealing resin, and a shield film covering the marking film. An upper surface of the marking film is locally formed with a first recess.

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Patent Owner(s)

  • MURATA MANUFACTURING CO LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Komatsu, Toru Nagaokakyo, JP 52 731
Nomura, Tadashi Nagaokakyo, JP 94 1037

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