Methods for registration of circuit dies and electrical interconnects

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12224184
APP PUB NO 20240282592A1
SERIAL NO

18652529

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.

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First Claim

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Patent Owner(s)

  • 3M INNOVATIVE PROPERTIES COMPANY

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Clarke, Graham M Woodbury, US 39 768
Goeddel, Teresa M St. Paul, US 9 5
Larsen, Jeremy K Farmington, US 71 1816
Mahajan, Ankit Cupertino, US 29 36
Meyers, Kara A Oakdale, US 28 15
Niccum, Kayla C Maplewood, US 15 7
Pekurovsky, Mikhail L Bloomington, US 122 665
Pitera, Gino L St. Paul, US 4 1
Shah, Saagar A Minneapolis, US 19 15
Smith, Matthew R D Woodbury, US 19 8

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