Method of manufacturing semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12224183
APP PUB NO 20230135424A1
SERIAL NO

17896171

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Importance

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Abstract

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A package including a first carrier, a seed layer, wires, a die and a molding material is provided. The first carrier is removed to expose the seed layer after disposing a second carrier on the molding material, then the seed layer is removed to expose the wires, and a gold layer is deposited on each of the wires by immersion gold plating, finally a semiconductor device is obtained. The gold layer is provided to protect the wires from oxidation and improve solder joint reliability.

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Patent Owner(s)

  • CHIPBOND TECHNOLOGY CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chwan-Tyaw Hsinchu, TW 1 0
Ho, Lung-Hua Hsinchu, TW 25 34
Hsu, Wen-Cheng Hsinchu County, TW 73 121
Jenq, Shrane-Ning Hsinchu County, TW 4 5
Kuo, Chih-Ming Hsinchu County, TW 49 242
Wang, Chen-Yu Hsinchu, TW 39 107

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