Embedded substrate, circuit board assembly, and electronic device
Number of patents in Portfolio can not be more than 2000
United States of America
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Feb 11, 2025
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N/A
app pub date -
Sep 29, 2022
filing date -
Sep 29, 2022
priority date (Note) -
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Abstract
This application provides an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate in this application includes an insulation layer, and an electronic element and a conductive connector that are embedded inside the insulation layer. The conductive connector is electrically connected to the electronic element. The conductive connector includes at least one fuse unit, each of the at least one fuse unit includes a fusible structure and two electrical connection ends, the fusible structure is connected between the two electrical connection ends in a direction of an electrical path of the conductive connector, and the fusible structure is configured to be blown when a passing current exceeds a preset current threshold, to disconnect an electrical connection between the electronic element and an external connection end. In this application, maintenance and replacement costs are low during current burning prevention, and a volume is compact.
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