Method of manufacturing integrated circuit having through-substrate via
Number of patents in Portfolio can not be more than 2000
United States of America
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Feb 11, 2025
Grant Date -
Nov 2, 2023
app pub date -
Jul 11, 2023
filing date -
Jul 11, 2023
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Abstract
A method includes generating an integrated circuit (IC) layout design and manufacturing an IC based on the IC layout design. Generating the IC layout design includes generating a pattern of a first shallow trench isolation (STI) region and a pattern of a through substrate via (TSV) region within the first STI region; a pattern of a second STI region surrounding the first STI region, the second STI region includes a first and second layout region, the second layout region being separated from the first STI region by the first layout region, first active regions of a group of dummy devices being defined within the first layout region, and second active regions of a group of active devices being defined within the second layout region; and patterns of first gates of the group of dummy devices in the first layout region, each of the first active regions having substantially identical dimension in a first direction.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
International Classification(s)

- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Chen, Ming-Fa | Taichung, TW | 524 | 4489 |
Chiang, Meng-Wei | Hsinchu, TW | 2 | 0 |
Hu, Chih-Chia | Taipei, TW | 52 | 329 |
Jan, Sen-Bor | Tainan, TW | 52 | 544 |
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