Fiber-to-chip grating coupler for photonic circuits

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United States of America

PATENT NO 12222554
APP PUB NO 20240151908A1
SERIAL NO

18417858

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Abstract

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Disclosed is a system and method for communication using an efficient fiber-to-chip grating coupler with a high coupling efficiency. In one embodiment, a method for communication, includes: transmitting optical signals between a semiconductor photonic die on a substrate and an optical fiber array attached to the substrate using at least one corresponding grating coupler on the semiconductor photonic die, wherein the at least one grating coupler each comprises a plurality of coupling gratings, a waveguide, a cladding layer, a first reflection layer and a second reflection layer, wherein the plurality of coupling gratings each comprises at least one step in a first lateral direction and extends in a second lateral direction, wherein the first and second lateral directions are parallel to a surface of the substrate and perpendicular to each other in a grating plane, wherein the first reflection layers are configured such that the plurality of coupling gratings is disposed between the first reflection layer and the cladding layer, wherein the second reflection layer are configured such that the cladding layer is disposed between the second reflection layer and the waveguide.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Huan-Neng Taichung, TW 161 745
Cho, Lan-Chou Hsinchu, TW 131 195
Jou, Chewn-Pu Hsinchu, TW 342 2019
Kuo, Feng-Wei Hsinchu County, TW 110 154

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