Seed slicer device
Number of patents in Portfolio can not be more than 2000
United States of America
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Feb 11, 2025
Grant Date -
Aug 25, 2022
app pub date -
Aug 21, 2020
filing date -
Aug 21, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A seed slicer device (100), which has: a first plate (102) provided with first holes (104); a second plate (106) provided with second holes (108), adapted to fit over the first plate; a sliding plate (110) slidably coupled to a top portion of the second plate, operable to cover the second holes; a third plate (112) provided with a third holes (114), adapted to fit over the second plate; and a cutting assembly (116) coupled to the third plate and adapted to slide over the third holes to provide a slicing action; the seeds are received by the third holes such that at least a first part of the seeds extend beyond the third holes, and, upon actuation of the cutting assembly, the seeds are cut by the cutting means to divide the seeds into corresponding first parts and second parts.
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