Solder paste bead recovery system and method
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Feb 11, 2025
Grant Date -
Dec 7, 2023
app pub date -
Aug 24, 2023
filing date -
Aug 24, 2023
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.
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- B23K Class
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Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Aug 11, 2028 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Aug 11, 2032 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 11, 2036 |