Method for pre-treating stainless steel substrates before soldering using nanocrystalline solder foils

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United States of America

PATENT NO 12220758
APP PUB NO 20220314353A1
SERIAL NO

17844203

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Abstract

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A soldered product comprising a first component soldered to a second component is provided. The first component comprises a stainless steel substrate, an adhesion promoter layer made of nickel deposited on at least one joining surface of the stainless steel substrate; and a tin layer deposited on the adhesion promoter layer. The tin layer has a layer thickness in the range of 10-30 μm. The second component is typically a rare earth magnet.

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Patent Owner(s)

  • VACUUMSCHMELZE GMBH & CO. KG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ankuda, Natalia Büdingen, DE 3 0
Reuther, Manfred Büdingen, DE 3 0
Zapf, Lothar Alzenau, DE 13 27

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