Ultra dense processors with embedded microfluidic cooling

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12219734
APP PUB NO 20230422435A1
SERIAL NO

17848755

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Abstract

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A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.

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Patent Owner(s)

  • MICROSOFT TECHNOLOGY LICENSING, LLC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Alissa, Husam Atallah Redmond, US 53 72
Belady, Christian L Mercer Island, US 220 5227
James, Sean Michael Olympia, US 27 48
Oruganti, Vaidehi Kirkland, US 16 5
Ramakrishnan, Bharath Bellevue, US 39 40

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