Forming trench in IC chip through multiple trench formation and deposition processes

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12219709
APP PUB NO 20240040701A1
SERIAL NO

18191787

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Abstract

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An integrated circuit (IC) chip assembly includes an integrated circuit (IC) die that includes a first substrate in which plurality of transistors is formed, a first structure that contains a plurality of first metallization components, and a second structure that contains a plurality of second metallization components. The first structure is disposed over a first side of the first substrate. The second structure is disposed over a second side of the first substrate opposite the first side. The chip assembly includes a second substrate bonded to the IC die through the second side. The chip assembly includes a trench that extends through the second substrate and through the second structure of the IC die. Sidewalls of the trench are defined at least in part by one or more protective layers.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, ChienYi Hsinchu, TW 1 0
Hsu, Wenmin Hsinchu, TW 2 0
Lin, Chia Hong Hsinchu County, TW 4 0
Lin, Yu-Ting Hsin-Chu, TW 197 1249
Liu, Kao-Chih Changhua County, TW 3 0

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