Semiconductor structure with source and drain electrode embedded within semiconductor layer and manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12218252
APP PUB NO 20230068105A1
SERIAL NO

17460969

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Abstract

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A semiconductor structure and a method for forming the semiconductor structure are disclosed. The semiconductor structure includes a dielectric layer and a transistor. The transistor is at least partially disposed in the dielectric layer. The transistor includes a gate electrode, a gate dielectric layer, a source electrode, a drain electrode and a semiconductor layer. The gate dielectric layer is disposed over the gate electrode. The source electrode and the drain electrode are disposed over the gate dielectric layer and contact the gate dielectric layer. The semiconductor layer is disposed over the gate dielectric layer.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsu, Pin-Cheng Hsinchu County, TW 45 43
Yu, Chia-Jung Hsinchu, TW 32 18

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