Semiconductor device and method of making a photonic semiconductor package

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12218114
APP PUB NO 20230125546A1
SERIAL NO

17452489

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Abstract

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A semiconductor device has an interposer. A first semiconductor die with a photonic portion is disposed over the interposer. The photonic portion extends outside a footprint of the interposer. The interposer and first semiconductor die are disposed over a substrate. An encapsulant is deposited between the interposer and substrate. The photonic portion remains exposed from the encapsulant.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, KyungOe Incheon, KR 31 140
Kim, YoungCheol Gyeonggi-do, KR 25 133
Lee, HeeSoo Incheon, KR 150 919

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