Bonding apparatus, bonding system, and bonding method

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12217963
APP PUB NO 20220277979A1
SERIAL NO

17594973

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Abstract

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A bonding apparatus configured to bond a first substrate and a second substrate includes: a first holder configured to hold the first substrate; a second holder disposed to face the first holder in a vertical direction, and configured to hold the second substrate; a processing vessel accommodating the first holder and the second holder therein; and a horizontal position adjuster provided outside the processing vessel and connected to the first holder via a support supporting the first holder, the horizontal position adjuster being configured to adjust a horizontal position of the first holder.

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Terada, Takashi Koshi, JP 116 641
Yamasaki, Yutaka Koshi, JP 16 263

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